2.5D vs. 3D Packaging, Advanced PCB Design Blog

ESD protection for 2.5D and 3D packages – SOFICS – Solutions for ICs

Design Guideline of 2.5D Package with Emphasis on Warpage Control and Thermal Management

2.5D and 3D IC Packaging

Micromachines, Free Full-Text

New Paradigms in ASIC: 2.5D and 3D ICs, Product Engineering Blog

The growth of advanced semiconductor packaging

2.5D and 3D IC Packaging

2.5D vs. 3D Packaging, Advanced PCB Design Blog

3D Packaging Versus 3D Integration

advanced packaging « PRADEEP's TECHPOINTS

Advanced packaging for the future of 2.5D and 3D